Card edge connector for an imaging sensor

ABSTRACT

The disclosure extends to devices, systems and methods for connecting one or more sensors to one or more printed circuit boards (PCB) in the distal end or tip of a scope. The disclosure also extends to a connector assembly for an image sensor for protecting the sensor and conveying information from the sensor to the PCB.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/666,210, filed Mar. 23, 2015 (now U.S. Pat. No. 10,084,944, issuedSep. 25, 2018) and claims the benefit of U.S. Provisional ApplicationNo. 61/968,959, filed Mar. 21, 2014, which are incorporated herein byreference in their entirety, including but not limited to those portionsthat specifically appear hereinafter, the incorporation by referencebeing made with the following exception: In the event that any portionof the above-referenced applications are inconsistent with thisapplication, this application supersedes said above-referencedapplications.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

BACKGROUND

The disclosure relates generally to card edge connectors and morespecifically, but not entirely, to card edge connectors for sensors,such as an image sensor. Advances in technology have provided advancesin imaging capabilities for medical use. One area that has enjoyed someof the most beneficial advances is that of endoscopic surgicalprocedures because of the advances in the components that make up anendoscope.

Conventional, digital video systems used for laparoscopy, arthroscopy,ENT, gynecology and urology are based upon conventional, rigidendoscopes, which are optically and mechanically coupled to a separatehand-piece unit, which contains one or more image sensor(s). Imageinformation is optically transmitted along the length of the endoscope,after which it is focused upon the sensor via an optical coupler.

However, due to advances in technology sensors are now being located inthe distal end or distal tip of medical or other type of scopes. Withsuch advancements come difficulties and problems associated withmechanically and electrically connecting the sensor to a printed circuitboard (PCB) in such scopes. Accordingly, devices, systems and methodsfor connecting sensors to PCBs in the distal end or tip of a scope areneeded. As will be seen, the disclosure provides such devices, systemsand methods for connecting sensors to PCBs in the distal end or tip of ascope in an effective and elegant manner.

The features and advantages of the disclosure will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by the practice of the disclosure withoutundue experimentation. The features and advantages of the disclosure maybe realized and obtained by means of the instruments and combinationsparticularly pointed out in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Non-limiting and non-exhaustive implementations of the disclosure aredescribed with reference to the following figures, wherein likereference numerals refer to like parts throughout the various viewsunless otherwise specified. Advantages of the disclosure will becomebetter understood with regard to the following description andaccompanying drawings where:

FIGS. 1A-1G illustrate various embodiments of an endoscopic system inaccordance with the principles and teachings of the disclosure;

FIGS. 2A-2D illustrate front, side cross-sectional, rear, and bottomcross-sectional views, respectively, of an endoscopic device inaccordance with the principles and teachings of the disclosure;

FIGS. 3A-3D illustrate front, side cross-sectional, rear, and bottomcross-sectional views, respectively, of a card edge connector device inaccordance with the principles and teachings of the disclosure;

FIGS. 4A-4C illustrate front, side cross-sectional and bottomcross-sectional views, respectively, of a card edge connector devicewith a sensor loaded therein in accordance with the principles andteachings of the disclosure;

FIGS. 5A-5C illustrate front, side cross-sectional, and bottomcross-sectional views, respectively, of a card edge connector devicewith a sensor loaded therein with wire bonds connecting the sensor toelectrical connectors, such as pins or pads, of the connector inaccordance with the principles and teachings of the disclosure;

FIGS. 6A-6C illustrate a front perspective view of a card edge connectordevice, a rear perspective view of the card edge connector device, and afront perspective view of the card edge connector device with a sensorloaded therein, respectively, in accordance with the principles andteachings of the disclosure;

FIGS. 7A-7C illustrate front, side cross-sectional and bottomcross-sectional views, respectively, of a card edge connector devicewith a sensor loaded proud of a plane of the connector in accordancewith the principles and teachings of the disclosure;

FIGS. 8A-8B illustrate perspective views of a card edge connector devicefor use with a backside illuminated sensor loaded proud of a plane ofthe connector in accordance with the principles and teachings of thedisclosure;

FIGS. 9A-9C illustrate front, side cross-sectional and bottomcross-sectional views, respectively, of a card edge connector devicewith a sensor loaded proud of a plane of the connector in accordancewith the principles and teachings of the disclosure; and

FIGS. 10A and 10B illustrate a front view and a side cross-sectionalview, respectively, of a conventional, prior art packaged imaging sensordevice.

DETAILED DESCRIPTION

The disclosure extends to devices, systems and methods for connectingone or more sensors to one or more printed circuit boards (PCB) in thedistal end or tip of a scope where lateral space may be limited. Thedisclosure also extends to a card edge connector for an image sensor forprotecting the sensor and conveying information from the sensor to thePCB, wherein the image sensor may be connected at one end of the cardedge connector and the PCB may be connected at the opposite end of thecard edge connector. The disclosure also extends to a card edgeconnector for an image sensor for protecting the sensor and conveyinginformation from the sensor to the PCB, wherein the image sensor may beconnected at one end of the card edge connector and the PCB may beconnected at the opposite end of the card edge connector in a verticaland substantially perpendicular orientation with respect to the printedcircuit board. A portion of a PCB may comprise traces leading to theedge of the board that are intended to plug into a matching card edgeconnector socket. The card edge connector may only require a femaleconnector where the male connector may be formed out of the edge of thePCB.

In the following description of the disclosure, reference is made to theaccompanying drawings, which form a part hereof, and in which is shownby way of illustration specific implementations in which the disclosuremay be practiced. It is understood that other implementations may beutilized and structural changes may be made without departing from thescope of the disclosure.

In describing and claiming the subject matter of the disclosure, thefollowing terminology will be used in accordance with the definitionsset out below.

It must be noted that, as used in this specification and the appendedclaims, the singular forms “a,” “an,” and “the” include plural referentsunless the context clearly dictates otherwise.

As used herein, the terms “comprising,” “including,” “containing,”“characterized by,” and grammatical equivalents thereof are inclusive oropen-ended terms that do not exclude additional, unrecited elements ormethod steps.

As used herein, the term “proximal” shall refer broadly to the conceptof a portion nearest an origin.

As used herein, the term “distal” shall generally refer to the oppositeof proximal, and thus to the concept of a portion farther from anorigin, or a furthest portion, depending upon the context.

Referring now to FIG. 1, there is illustrated various embodiments of anendoscopic system 100. It will be appreciated that the system 100 maycomprise many different configurations. One example is shown in FIG. 1A,which illustrates an endoscopic system 100 comprising a rigid angledscope 102, an optical coupler 104, a handpiece 106, an image sensor 108,which may be located within the handpiece 106 or distally at a tip ofthe endoscope 102 as illustrated in dashed lines, an electronic cable110, a light cable 112, such as a fiber optic cable, a light source 114,a control unit 116, such as a camera control unit (CCU), a video cable118 and a display 120.

The system configuration shown in FIG. 1B illustrates an endoscopicsystem 100 comprising a rigid angled scope 102, an optical coupler 104,a handpiece 106, an image sensor 108, which may be located within thehandpiece 106 or distally at a tip of the endoscope 102 as illustratedin dashed lines, an electronic cable 110, a light cable 112, such as afiber optic cable, a control unit 116, such as a camera control unit(CCU), with an integrated light source 114, a video cable 118, and adisplay 120.

The system configuration shown in FIG. 1C illustrates an endoscopicsystem 100 comprising an articulating scope 102, an optical coupler 104,a handpiece 106, an image sensor 108, which may be located within thehandpiece 106 or distally at a tip of the endoscope 102 as illustratedin dashed lines, an electronic cable 110, a light cable 112, such as afiber optic cable, a light source 114, a control unit 116, such as acamera control unit (CCU), a video cable 118 and a display 120.

The system configuration shown in FIG. 1D illustrates an endoscopicsystem 100 comprising a handpiece 106 with an integrated rigid 0 degreescope 102, an image sensor 108, which may be located within thehandpiece 106 or distally at a tip of the scope 102 as illustrated indashed lines, a combined electronic and light cable 110, a control unit116, such as a camera control unit (CCU) with an integrated light source114, a video cable 118 and a display 120.

The system configuration shown in FIG. 1E illustrates an endoscopicsystem 100 comprising a handpiece 106 with an integrated rigid angledscope 102 and rotation post 105, an image sensor 108, which may belocated within the handpiece 106 or distally at a tip of the scope 102as illustrated in dashed lines, a combined electronic and light cable110, a control unit 116, such as a camera control unit (CCU) with anintegrated light source 114, a video cable 118 and a display 120.

The system configuration shown in FIG. 1F illustrates an endoscopicsystem 100 comprising a handpiece 106 with an integrated articulatingscope 102, an image sensor 108, which may be located within thehandpiece 106 or distally at a tip of the scope 102 as illustrated indashed lines, a combined electronic and light cable 110, a control unit116, such as a camera control unit (CCU) with an integrated light source114, a video cable 118 and a display 120.

The system configuration shown in FIG. 1G illustrates an endoscopicsystem 100 comprising a handpiece 106 with an integrated flexible scope102, an image sensor 108, which may be located within the handpiece 106or distally at a tip of the scope 102 as illustrated in dashed lines, acombined electronic and light cable 110, a control unit 116, such as acamera control unit (CCU) with an integrated light source 114, a videocable 118 and a display 120.

It will be appreciated that any of the above-identified configurationsfor an endoscopic system shown in FIGS. 1A-1G, any combination of theabove elements in a different configuration, and any other configurationused for Minimally Invasive Surgery, are intended to fall within thescope of this disclosure.

In an implementation of the system 100 for providing an image in a lightdeficient environment, the system may comprise a surgical scope, whichitself may comprise a tubular member having a proximal portion and adistal portion. The system 100 may further comprise a light source, acamera control unit (CCU), and a display. As described more fully hereinbelow, the surgical scope may comprise a connector assembly that may belocated at the distal portion of the tubular member and may have a firstend, a second end, and a plurality of electrical connectors. Theconnector assembly may also receive therein a printed circuit board andan image sensor. In such an implementation, the image sensor may beconnected to the connector assembly at the first end of and the printedcircuit board may be connected to the connector assembly at the secondend, such that the connector assembly attaches the image sensor at thedistal portion of the tubular member and electrically connects the imagesensor to the printed circuit board via the plurality of electricalconnectors, thereby providing electrical communication between the imagesensor and the printed circuit board.

Referring now to FIGS. 2A-2D, an endoscopic device 200 is illustrated.The endoscopic device 200 may comprise a tubular member, such as anouter scope tube 202, a lens assembly 204, a connector or card edgeconnector 206, an image sensor 208, a card edge PCBA 210, and aplurality of wires and/or a wire harness and/or other communicationcomponents 212. It will be appreciated that the connector 206 maysometimes be referred to herein as a connector assembly 206 because aconnector may comprise sub-components that when assembled form acomplete connector.

The endoscopic device is illustrated in FIGS. 2A-2D with the imagingsensor 208 located at a distal portion 203, or at a tip, of the outerscope tube 202. It will be appreciated that the endoscopic device 200may comprise: an outer scope tube 202, a lens assembly 204 complete withvarious optical elements that may be used in conventional endoscopicdevices, which are not shown for purposes of clarity, a card edgeconnector 206 for housing or securing an image sensor 208 at a firstend, which may be a distal end or distal portion 206 a of the connector206 as illustrated, connecting to a card edge PCBA 210 at a second orproximal end 206 b, and wires and/or a wire harness and/or othercommunication components 212 to convey a signal from the card edge PCBA210 to the image processor (not illustrated), which may be locatedremotely with respect to the image sensor, for example, in the handpieceof an imaging device or camera, or in the camera control unit (CCU), orfurther up the length of a lumen.

The image sensor 208 may include an image sensor silicon die, a pixelarray 209, and a plurality of sensor pads for electrically communicatingwith corresponding electrical connectors, such as pins or pads. Theimage sensor 208 may include a plurality of bonds 221, such as wirebonds, which connect the plurality of sensor pads 220 to a correspondingplurality of electrical connectors 222, such as pins or pads, which maybe part of the connector 206.

It will be appreciated that the card edge connector 206 may be used as apackage to house the sensor 208. Additionally, it should be understoodthat structures of the card edge connector 206 may aid in themanufacture and transport of the sensor as part of sensor packaging. Onepurpose for the card edge connector or package 206 is to simplify theprocess of connecting the imaging sensor 208 to the wiring harness 212.The card edge connector or package 206 may facilitate sensor connectionto a wiring harness 212.

It will be appreciated that FIGS. 2A-2D illustrate the PCBA 210 beingconnected to the connector assembly 206 at the second end 206 b of theconnector assembly 206. Conversely, the image sensor 208 is illustratedas being connected to the connector assembly 206 at the first end 206 a,such that the connector assembly 206 attaches the image sensor 208 atthe distal portion 203 of the tubular member 202 and electricallyconnects the image sensor 208 to the PCBA 210 via the plurality ofelectrical connectors 222, thereby providing electrical communicationbetween the image sensor 208 and the PCBA 210. It will be appreciated bythose skilled in the art that the connector assembly 206 may be used inconjunction with any elongated configuration in addition to a generallytubular configuration and such elongated configurations are intended tofall within the scope of this disclosure.

The connector assembly 206 may operate to attach the image sensor 208within the distal portion 203 of the tubular member 202 in a verticaland substantially perpendicular orientation (as illustrated best in FIG.2D) with respect to the PCBA 210. In an implementation, the PCBA 210 maybe attached perpendicularly out of the center of and with respect to theimage sensor 208. In an implementation, the PCBA 210 may be attachedperpendicularly off of an edge of and with respect to the image sensor208. As illustrated, the image sensor 208 may be located substantiallybeneath a plane (illustrated by dashed line P in FIG. 2D) of theelectrical connectors 222 at the first end 206 a of the connectorassembly 206, such that the plane of the electrical connectors 222 atthe first end 206 a of the connector assembly 206 is locatedsubstantially above the image sensor 208. In this configuration, thepixel array 209 of the image sensor 208 is located beneath the plane(illustrated by dashed line P in FIG. 2D) of the electrical connectors222 at the first end 206 a of the connector assembly 206.

Referring now to FIGS. 3A-3D, the figures illustrate a front, sidecross-sectional, rear, and bottom cross-sectional views, respectively,of the card edge connector device 206 in accordance with the principlesand teachings of the disclosure. The card edge connector 206 of FIGS.3A-3D is illustrated without the scope or endoscopic device, includingthe outer scope tube 202, for purposes of clarity and simplicity indiscussing the details of the connector 206.

It will be appreciated that the card edge connector 206 may beconfigured, dimensioned and built to help minimize the overall size ofthe package, for example, in the x-dimension (width) and the y-dimension(height). Accordingly, one end 206 a of the connector 206, which may bea first end or at the distal end or distal portion, may be optimized forplacement of the sensor 208 in order to protect the wire-bonds that mayconnect the sensor 208 to the plurality of electrical connectors 222,such as pins or pads, of the connector 206, and to provide overallprotection of the sensor 208.

To facilitate the above, the card edge connector 206 may comprise acavity or recess 230 for receiving therein the sensor 208 and silicondie. The other end 206 b, which may be a second end or a proximal end,of the connector 206 may be optimized to accept the edge card PCBA 210(illustrated best in FIGS. 2B and 2D). At this end 206 b, a first slot,socket or receptacle 232 (as illustrated best in FIGS. 3B-3D) may beprovided to accept or receive therein the edge card PCBA 210. It will beappreciated that the PCBA 210 may be held in the first slot, socket orreceptacle 232 via a bias force. The plurality of electrical connectors222 may extend into the first slot, socket or receptacle 232, such thatwhen the PCBA 210 is located within the first slot 232 the electricalconnectors 222 of the connector assembly 206 may be in electricalcommunication with corresponding electrical connectors on the PCBA 210.The connector 206 may further comprise a vertical slot or channel 250for receiving fiber optic cable strands therein.

FIGS. 4A-4C illustrate a front, side cross-sectional, and bottomcross-sectional views, respectively, of the card edge connector device206 with a sensor 208 loaded therein in accordance with the principlesand teachings of the disclosure. It will be appreciated that the sensor208 may be loaded in the cavity 230 as discussed above in connectionwith FIGS. 3A-3D. It will be appreciated that the imaging sensor 208 andsilicon die may be attached or otherwise connected to the connector 206using any mechanical mechanism and/or an adhesive or other bond. Forexample, the imaging sensor 208 may comprise a plurality of sensor padsor electrical connectors 220 that may be bonded or otherwise connectedto the electrical connectors 222 of the card edge connector 206 with aplurality of bonds 221, such as wire bonds.

In the configuration illustrated in FIGS. 4A-4C, the pixel array 209 ofthe image sensor 208 is located on the same plane or substantially thesame plane (illustrated by dashed line P in FIG. 4C) as the electricalconnectors 222 at the first end 206 a of the connector assembly 206.

In an implementation of the disclosure illustrated best in FIGS. 7A-7C,adhesive may be used to attach the sensor 208 to the connector 206. Theadhesive may be electrically conductive adhesive, and may be, forexample, gold or silver filled adhesive or other metallic filledadhesive. The adhesive may be placed in controlled locations of theconnector 206 to electrically connect the silicon die to a specific pinof the connector 206, such as the ground pin. As illustrated best inFIG. 7C, the controlled location may be an individual cavity or otherreceptacle 224 to receive the electrically conductive adhesive therein.As illustrated in 7C, a ground pin 222 a is shown as being electricallyconnected to the sensor pad 220 by a wire bond 221 to the ground pin 222a. In other words, the ground pin 222 a may be electrically connected tothe silicon die of the sensor by an electrically conductive adhesive toprovide an improved electrical ground path for the sensor. Asillustrated, the wire bond 221 may be run on the outside of the sensorto the one or more electrical connectors 222, such as pins. It will beappreciated that the attachment of the electrically conductive adhesiveto the ground pin 222 a may reduce the amount of noise in the sensor 208and may increase signal integrity as compared to a sensor attached to aground pin without any epoxy or electrically conductive adhesive.

FIGS. 5A-5C illustrate front, side cross-sectional, and bottomcross-sectional views, respectively, of the card edge connector device206 with a sensor 208 loaded therein with wire bonds 221 connecting thesensor 208 to electrical connectors 222, such as pins or pads, of theconnector 206 in accordance with the principles and teachings of thedisclosure. As illustrated best in FIG. 5B, the connector 206 maycomprise the cavity 230 that may be defined by a sidewall 209. Invarious implementations, the sidewall 209 may comprise a height, suchthat the sidewall 209 extends above and beyond the sensor 208. Invarious implementations, the connector assembly 206 may comprise thecavity 230 or a partial cavity that may comprise a sidewall 209 and thatis located at the first end 206 a of the connector 206. It will beappreciated that the image sensor 208 may be located within the cavity230 or partial cavity, such that the sidewall 209 surrounds at least aportion of the image sensor 208, thereby protecting the image sensor 208and electrical connectors 221, 222 from damage. In an implementation,the image sensor 208 may be completely surrounded by the sidewall 209.In an implementation, the image sensor 208 may be partially surroundedby the sidewall 209. In an implementation, the image sensor 208 may notbe surrounded by the sidewall 209, but may instead sit proud of and withrespect to the connector 206.

In the configuration illustrated in FIGS. 5A-5C, the pixel array 209 ofthe image sensor 208 is located on the same plane or substantially thesame plane (illustrated by dashed line P in FIG. 5C) as the electricalconnectors 222 at the first end 206 a of the connector assembly 206.

FIGS. 6A-6C illustrate a front, three-dimensional view of the card edgeconnector device 206, a rear, three-dimensional view of the card edgeconnector device 206, and a front, three-dimensional view of the cardedge connector device 206 with a sensor 208 loaded therein,respectively, in accordance with the principles and teachings of thedisclosure. The three images illustrated in FIGS. 6A-6C, illustrate theconcept disclosed herein for the card edge connector 206. In animplementation, the housing of the connector 206 may comprise 3.5 mmhousing outer diameter. In an implementation, the connector 206 maycomprise six contacts or electrical connectors 222. In animplementation, the connector 206 may comprise a fine pitch (e.g., about0.5 mm to about 0.6 mm) In an implementation, the connector 206 maycomprise a first end or distal end 206 a comprising the cavity or recess230 to hold and receive the sensor die therein. In an implementation,the connector 206 may comprise a second end or proximal end 206 bcomprising a socket or receptacle 232 to accept or receive a micro edgecard or PCBA therein. In an implementation, the PCBA may comprise arigid PCB and features to connect a wire harness as is known in the art.In an implementation, the PCBA may comprise a flat flexible PCB.

FIGS. 7A-7C illustrate front, side cross-sectional and bottomcross-sectional views, respectively, of a card edge connector device 206with a sensor 208 loaded proud of a plane of the connector in accordancewith the principles and teachings of the disclosure. The figuresillustrate an implementation in which the sensor 208 may sit proud abovethe plane (represented by dashed line P) of the electrical connectors222, such as pins or pads, at the first end 206 a of the connectorassembly 206 as illustrated best in FIG. 7C. In this configuration, thepixel array 209 of the image sensor 208 is located above a plane(represented by dashed line P) of the electrical connectors 222 at thefirst end 206 a of the connector assembly 206. This configuration mayallow the electrical connectors 222, such as pins or pads, of theconnector assembly 206 to sit under the sensor 208 rather than beingpositioned on either side of the sensor 208 as in other implementationsdisclosed herein. This configuration may enable a smaller overallhousing diameter and an overall smaller housing package or assembly foruse with tubular members having small diameters, such as an endoscopehaving a diameter of 5 mm or less.

In an implementation of the disclosure illustrated best in FIGS. 7A-7C,adhesive may be placed in controlled locations of the connector 206 toelectrically connect the silicon die of the image sensor 208 to aspecific pin of the connector 206, such as the ground pin. Asillustrated best in FIG. 7C, the controlled location may be anindividual cavity or other receptacle 224 to receive the electricallyconductive adhesive therein. As illustrated in 7C, a ground pin 222 a isshown as being electrically connected to the sensor pad 220 by a wirebond 221 to the ground pin 222 a. In other words, the ground pin 222 amay be electrically connected to the silicon die of the sensor by anelectrically conductive adhesive to provide an improved electricalground path for the sensor. As illustrated, the wire bond 221 may be runon the outside of the sensor to the one or more electrical connectors222, such as pins. This configuration allows for an overall smallerhousing for use with tubular members having small diameters, such as anendoscope having a diameter of 5 mm or less. It will be appreciated thatthe attachment of the electrically conductive adhesive to the ground pin222 a may reduce the amount of noise in the sensor 208 and may increasesignal integrity as compared to a sensor attached to a ground pinwithout any epoxy or electrically conductive adhesive.

FIGS. 8A-8B illustrate perspective views of a card edge connector device206 for use with a backside illuminated sensor 208 loaded proud of aplane P of the connector 206 in accordance with the principles andteachings of the disclosure. In this implementation, the pixel array 209of the image sensor 208 is located above a plane of the electricalconnectors 222 at the first end 206 a of the connector assembly 206. Thefigures illustrate an implementation in which the sensor 208 isconstructed using a backside illumination (BSI) manufacturing processresulting in the sensor pads 220 being located on the opposite side ofthe silicon die as the pixel array 209. As shown, this BSI sensor may beused with the card edge connector 206 disclosed herein. The pads 220 ofBSI sensor 208 may be bonded directly to the electrical connectors 222,such as pins or pads, of the card edge connector 206 without the needfor wire bonds. Referring specifically to FIG. 8A, pad 220 b may bebonded directly to the electrical connector 222 b without the need forwire bonds. Such direct bonding may occur with respect to all sensorpads 220 and all electrical connectors 222. It will be appreciated thatthe pads 220 that may be located on the underside of the sensor 208 maybe soldered onto the electrical connectors 222 of the connector assembly206.

FIGS. 9A-9C illustrate front, side cross-sectional and bottomcross-sectional views, respectively, of a card edge connector device 206with a sensor 208 loaded proud of a plane (represented by dashed line P)at the first end 206 a of the connector assembly 206 in accordance withthe principles and teachings of the disclosure. In this implementation,the pixel array 209 of the image sensor 208 is located above a plane(represented by dashed line P) of the electrical connectors 222 at thefirst end 206 a of the connector assembly 206.

The figures illustrate an implementation in which the sensor 208 isconstructed using a backside illumination (BSI) manufacturing processresulting in the sensor pads 220 being located on the opposite side ofthe silicon die as the pixel array 209. As can be seen in FIGS. 9A-9C,which implement the details of FIGS. 8A-8B, this configuration may allowthe card edge connector 206 diameter to shrink with respect to the sizeof the sensor 208 resulting in a more efficient use of the limited spaceavailable in a tubular member having a sensor located distally therein,while still retaining the benefits of the connector assembly 206. Thisefficiency gain can be used to put a larger sensor in a specific scopediameter, or to shrink the scope diameter around a specific sensor size,either of which may result in improved clinical efficiency.

It will be appreciated that the disclosure illustrates in FIGS. 1A-6Cand describes herein novel devices, systems and methods for packaging asilicon imaging sensor die that: (1) protects the sensor 208 and wirebonds 221 from damage; and/or (2) minimizes the footprint of the finalcard edge connector 206 assembly; and/or (3) enables simple mechanicalconnection to a PCBA with an attached wire harness that carries data toa remote or off-site image processing hardware. The abovecharacteristics may be important for applications in which space isminimal, such as in an endoscopic application with the image sensorlocated distally within a tip of the scope or any other application inwhich physical space is limited.

FIGS. 10A and 10B illustrate a top view and a cross-sectional view,respectively, of a conventional, prior art packaged imaging sensordevice. It will be appreciated that the connector 206 of the disclosureprovides significant advantages over a conventional package for an imagesensor. A common method of packaging silicon die comprising an imagingsensor is illustrated. It will be appreciated that the ceramic packagehas a glass lid to protect the die and the wire bonds as illustrated.Conventional packages are optimized to keep height of the image sensorto a minimum, but the footprint of the image sensor is very large incomparison to the footprint of the image sensor disclosed herein. Due tothe mechanical constraints of being located within a tip or distal endof an endoscope or other application where space is constrained, a largefootprint is unworkable or undesirable. Conventional packages for animage sensor are optimized for a surface-mount solder process to attachthe PCBA, which has local image processing hardware and circuitry (e.g.,image processing hardware and circuitry on the same PCBA as the imagesensor), but such a configuration may be difficult to connect to a wireharness.

It will be appreciated that the teachings and principles of thedisclosure may be used in a reusable device platform, a limited usedevice platform, a re-posable use device platform, or asingle-use/disposable device platform without departing from the scopeof the disclosure. It will be appreciated that in a re-usable deviceplatform an end-user is responsible for cleaning and sterilization ofthe device. In a limited use device platform the device can be used forsome specified amount of times before becoming inoperable. Typical newdevice is delivered sterile with additional uses requiring the end-userto clean and sterilize before additional uses. In a re-posable usedevice platform a third-party may reprocess the device (e.g., cleans,packages and sterilizes) a single-use device for additional uses at alower cost than a new unit. In a single-use/disposable device platform adevice is provided sterile to the operating room and used only oncebefore being disposed of.

In the foregoing Detailed Description of the Disclosure, variousfeatures of the disclosure may have been grouped together in a singleembodiment for the purpose of streamlining the disclosure. This methodof disclosure is not to be interpreted as reflecting an intention thatthe claimed disclosure requires more features than are expressly recitedin each claim. Rather, inventive aspects lie in less than all featuresof a single foregoing disclosed embodiment.

It is to be understood that the above-described arrangements are onlyillustrative of the application of the principles of the disclosure.Numerous modifications and alternative arrangements may be devised bythose skilled in the art without departing from the spirit and scope ofthe disclosure and the appended claims are intended to cover suchmodifications and arrangements.

Thus, while the disclosure has been shown in the drawings and describedabove with particularity and detail, it will be apparent to those ofordinary skill in the art that numerous modifications, including, butnot limited to, variations in size, materials, shape, form, function andmanner of operation, assembly and use may be made without departing fromthe principles and concepts set forth herein.

Further, where appropriate, functions described herein can be performedin one or more of: hardware, software, firmware, digital components, oranalog components. For example, one or more application specificintegrated circuits (ASICs) can be programmed to carry out one or moreof the systems and procedures described herein. Certain terms are usedthroughout the following description and Claims to refer to particularsystem components. As one skilled in the art will appreciate, componentsmay be referred to by different names. This document does not intend todistinguish between components that differ in name, but not function.

What is claimed is:
 1. A surgical scope for providing an image in alight deficient environment comprising: a tubular member comprising aproximal portion and a distal portion; a printed circuit board; and animage sensor; a connector assembly that is located at the distal portionof the tubular member and comprising a first end that receives the imagesensor, a second end having a recess for receiving the printed circuitboard, and a plurality of electrical connectors between the first endand the second end for electrically connecting the printed circuit boardto the image sensor; wherein the image sensor is connected to theconnector assembly at the first end of said connector assembly, whereinthe printed circuit board is connected to the connector assembly at thesecond end of said connector assembly, such that the connector assemblyattaches the image sensor at the distal portion of the tubular memberand electrically connects the image sensor to the printed circuit boardvia the plurality of electrical connectors, thereby providing electricalcommunication between the image sensor and the printed circuit board,and wherein the connector assembly attaches the image sensor and theprinted circuit board within the tubular member such that the imagesensor is disposed in an orientation that is substantially perpendicularto the printed circuit board.
 2. The surgical scope of claim 1, whereinthe printed circuit board is attached perpendicularly out of the centerof and with respect to the image sensor.
 3. The surgical scope of claim1, wherein the printed circuit board is attached perpendicularly off ofan edge of and with respect to the image sensor.
 4. The surgical scopeof claim 1, wherein the image sensor comprises a plurality of electricalpads that are electrically attached to the plurality of electricalconnectors via wire bonds.
 5. The surgical scope of claim 1, wherein theimage sensor is electrically attached to one of the plurality ofelectrical connectors via an electrically conductive adhesive.
 6. Thesurgical scope of claim 5, wherein the image sensor is electricallyattached to the plurality of electrical connectors via wire bonds;wherein the image sensor comprises a silicon die; and wherein theelectrically conductive adhesive is placed in controlled locations ofthe connector assembly to electrically connect a backside of the silicondie to a ground in the connector assembly.
 7. The surgical scope ofclaim 1, wherein the image sensor is backside illuminated and comprisesa plurality of electrical pads that are soldered to the plurality ofelectrical connectors of the connector assembly to thereby electricallyattach the image sensor to the connector assembly.
 8. The surgical scopeof claim 1, wherein the image sensor is located above a plane of theelectrical connectors at the first end of the connector assembly, suchthat the electrical connectors are located underneath the image sensor.9. The surgical scope of claim 1, wherein the connector assemblycomprises a cavity comprising a sidewall at the first end, wherein theimage sensor is located within the cavity such that the sidewall of saidcavity surrounds at least a portion of the image sensor, therebyprotecting the image sensor and electrical connectors.
 10. The surgicalscope of claim 9, wherein the image sensor comprises a pixel array thatis located above a plane of the electrical connectors at the first endof the connector assembly.
 11. The surgical scope of claim 9, whereinthe image sensor comprises a pixel array that is located on the sameplane as the electrical connectors at the first end of the connectorassembly.
 12. The surgical scope of claim 9, wherein the image sensorcomprises a pixel array that is located beneath a plane of theelectrical connectors at the first end of the connector assembly. 13.The surgical scope of claim 1, wherein the recess comprises a slot forreceiving the printed circuit board therein; and wherein the printedcircuit board is held in the slot via a bias force.
 14. The surgicalscope of claim 13, wherein the plurality of electrical connectors extendinto the slot, such that when the printed circuit board is locatedwithin the slot the electrical connectors of the connector assembly arein electrical communication with corresponding electrical connectors onthe printed circuit board.
 15. A system for providing an image in alight deficient environment, the system comprising: a surgical scopecomprising a tubular member comprising a proximal portion and a distalportion; a light source; a camera control unit; and a display; whereinthe surgical scope comprises: a printed circuit board; and an imagesensor; a connector assembly that is located at the distal portion ofthe tubular member and comprising a first end that receives the imagesensor, a second end having a recess for receiving the printed circuitboard, and a plurality of electrical connectors between the first endand the second end for electrically connecting the printed circuit boardto the image sensor; wherein the image sensor is connected to theconnector assembly at the second end of said connector assembly, whereinthe printed circuit board is connected to the connector assembly at thefirst end of said connector assembly, such that the connector assemblyattaches the image sensor at the distal portion of the tubular memberand electrically connects the image sensor to the printed circuit boardvia the plurality of electrical connectors, thereby providing electricalcommunication between the image sensor and the printed circuit board,and wherein the connector assembly attaches the image sensor and theprinted circuit board within the tubular member such that the imagesensor is disposed in an orientation that is substantially perpendicularto the printed circuit board.
 16. The system of claim 15, wherein theprinted circuit board is attached perpendicularly out of the center ofand with respect to the image sensor.
 17. The system of claim 15,wherein the printed circuit board is attached perpendicularly off of anedge of and with respect to the image sensor.
 18. The system of claim15, wherein the image sensor comprises a plurality of electrical padsthat are electrically attached to the plurality of electrical connectorsvia wire bonds.
 19. The system of claim 15, wherein the image sensor iselectrically attached to one of the plurality of electrical connectorsvia an electrically conductive adhesive.
 20. The system of claim 19,wherein the image sensor is electrically attached to the plurality ofelectrical connectors via wire bonds; wherein the image sensor comprisesa silicon die; and wherein the electrically conductive adhesive isplaced in controlled locations of the connector assembly to electricallyconnect a backside of the silicon die to a ground in the connectorassembly.
 21. The system of claim 15, wherein the image sensor isbackside illuminated and comprises a plurality of electrical pads thatare soldered to the plurality of electrical connectors of the connectorassembly to thereby electrically attach the image sensor to theconnector assembly.
 22. The system of claim 15, wherein the image sensoris located above a plane of the electrical connectors at the first endof the connector assembly, such that the electrical connectors arelocated underneath the image sensor.
 23. The system of claim 15, whereinthe connector assembly comprises a cavity comprising a sidewall at thefirst end, wherein the image sensor is located within the cavity suchthat the sidewall of said cavity surrounds at least a portion of theimage sensor, thereby protecting the image sensor and electricalconnectors.
 24. The system of claim 23, wherein the image sensorcomprises a pixel array that is located above a plane of the electricalconnectors at the first end of the connector assembly.
 25. The system ofclaim 23, wherein the image sensor comprises a pixel array that islocated on the same plane as the electrical connectors at the first endof the connector assembly.
 26. The system of claim 23, wherein the imagesensor comprises a pixel array that is located beneath a plane of theelectrical connectors at the first end of the connector assembly. 27.The system of claim 15, wherein the recess comprises a slot forreceiving the printed circuit board therein; and wherein the printedcircuit board is held in the slot via a bias force.
 28. The system ofclaim 27, wherein the plurality of electrical connectors extend into theslot, such that when the printed circuit board is located within theslot the electrical connectors of the connector assembly are inelectrical communication with corresponding electrical connectors on theprinted circuit board.